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Event date & time:
13.11.2020 at 00:00
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Location
CA
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Category
Business
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Added by:
harryetek@outlook.com
Drivers causing this growth are increasing smartphone production for the expense of feature phones, an increase within the usage and complexity of automotive electronics and also the Internet of Things IC chip supplier. The latter these has shown huge rise in the proliferation of smart sensing devices in additional and more smart connected “things.”
This almost insatiable demand is fueling many technologies and new developments from the semiconductor industry. Such innovations range from the introduction of latest process technologies and new power-efficient design techniques, including the use of cost-effective fabrication processes that integrate control logic, analog functions and robust power stages.
The China Integrated Circuit Industry Investment Fund Co. will take foreign money, the country’s tech industry overseer said on April 25.
In particular, NASA said SiC applications includes energy storage, sustainable energy, nuclear power, electrical drives. The use of the high temperature packaging and operation of SiC power modules for the power electronics equipment provides about the advantages of increase in power density, decrease in heat sink requirements (thus smaller size and mass), greater frequency operation which also results in lower mass with the filters and transformers.
At these nodes, chipmakers will probably require new equipment, for example the next version of extreme ultraviolet (EUV) lithography. New deposition, etch and inspection/metrology technologies are also within the works.
Needless to mention, the look and manufacturing cost is astronomical here. The design cost to get a 3nm chip is $650 million, when compared with $436.3 million for just a 5nm device, and $222.3 million for 7nm, in accordance with IBS. Beyond those nodes Analog ICs , it’s too early to state how much a chip will surely cost.Not all designs require advanced nodes. In fact, rising price is prompting many to understand more about other options, for instance advanced packaging.